Microcontroller Socket Market Size To Reach $1.46 Billion By 2024

Some recent Developments

· COVID-19 has actually brought a good news for the chip industry, as shift in focus towards IoT and other related technologies has been observed. Multiple projects have been initiated by the industry giants, which has led to reinvigoration of the vitality in the industry. This shift has caused a greater push to the demands for microcontrollers as well as for its sockets and will be buoyant in the coming years as well, leading to greater revenue generation. Also, with the manufacturing process coming back to its previous state in several countries after lifting of the lockdown restrictions, normalcy is set to return for sure.

· In March 2019, Samtec announced the release of mPOWER connectors — the ultimate micro high-power solution with incredible design flexibility for power-only or power/signal applications. This 2.00 mm pitch power connector system (UMPT/UMPS) features a small form factor while achieving up to 18 Amps per blade. This micro high-power system not only saves board space, but also carries extremely high amperage per square inch. Compared to traditional power connectors that carry 20 Amps per blade in a large form factor, mPOWER passes 18 Amps per blade in about half the size, freeing up the board for other components or minimizing package size. This product is a good fit for several industries and will aid with size minimization across all applications, saving more on costs and time.

· In December 2018, Mill-Max Mfg., Corp., North America’s largest manufacturer of Precision Machined interconnects presented its lowest profile strip sockets. With an above-board height of just .083” (2,11 mm) these sockets provide a reliable and convenient way to connect boards or devices. They are designed for through hole mounting in boards up to .062” (1,57 mm) thick, providing a secure connection to the PCB. These sockets are ideal for board stacking and wire to board applications where minimizing package height is paramount. It keeps the temperature in check and provides efficiency to the customers, which has led to increased demands for it in these years.

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· In July 2018, Mill-Max Mfg. Corp. introduced new Horizontal SMT (HSMT) headers and sockets suited for low-profile parallel board-to-board or board-to-component mating. The removable plastic cap provides the convenience of a traditional connector and once removed delivers an interconnect system with a minimal surface mount profile. These new sockets, 835–43–0XX-40–030001, and headers, 328–10–1XX-40–020001 are an excellent choice for applications where vertical board stacking is not an option, such as in LED lighting systems which often employ daisy-chained PCBs to minimize overall package height. These products bring variety and novel innovation to the table, pushing the growth rate of the market ahead and creating good demand.

· Samtec, Inc., a leading provider of high bandwidth and micro-pitch interconnect systems, announced the acquisition of nMode Solutions, of Oro Valley, Arizona. It also acquired Triton Microtechnologies, which is the subsidiary of nMode Solutions. nMode Smart Modules, RF filters, and evaluation boards support the high-performance, high-density demands of the IC Packaging industry. Utilizing Triton Microtechnologies patented Glass Core Technology, nMode designers use the superior performance and material characteristics of glass to achieve significant miniaturization and integration far beyond what is possible with organic materials.

· In December 2018, AVNET, a leading global technology solutions provider, has extended its distribution agreement with Samtec, Inc. (U.S.). This development provides Samtec, Inc, greater reach in Asia Pacific region and will go on to boost its market potential.